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罗斌森
  • LT1013CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Slew Rate : 0.4V/μs
    Gain Bandwidth Product : 1MHz
    Current - Input Bias : 15nA
    Voltage - Input Offset : 60μV
    Current - Supply : 350μA
    Voltage - Supply, Single/Dual (±) : 4V ~ 44V, ±2V ~ 22V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
MSP430F168IRTDT TI 64-VQFN (9x9) New 详细
TMS5703137DPGEQQ1 TI 144-LQFP (20x20) New 详细
SN74AC533PWE4 TI 20-TSSOP New 详细
TPS61040DDCT TI SOT-23-5 New 详细
CC1100RTKG3 TI New 详细
LP3874ES-2.5/NOPB TI DDPAK/TO-263-5 New 详细
TPS8268150SIPT TI 9-USIP New 详细
OPA333AIDCKT TI SC-70-5 New 详细
TMSDM6467CCUTV6TAN TI 529-FCBGA (19x19) New 详细
TPS61181ARTET TI 16-WQFN (3x3) New 详细
LP3972SQE-E514/NOPB TI 40-WQFN (5x5) New 详细
TPS613226ADBVR TI SOT-23-5 New 详细
BQ29414PW TI 8-TSSOP New 详细
LME49720HABD TI New 详细
SN74LVC541APWT TI 20-TSSOP New 详细
LM2931T-5.0/NOPB TI TO-220-3 New 详细
LMH6629SD/NOPB TI 8-WSON (3x3) New 详细
AM1806EZWT4 TI 361-NFBGA (13x13) New 详细
LM5070SD-50/NOPB TI 16-WSON (5x5) New 详细
LP3855ESX-3.3 TI DDPAK/TO-263-5 New 详细