产品系列
TMS5703137DPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2502SM/NOPB | TI | 49-NFBGA (4x4) | New | 详细 | |
| ADC3424IRTQ25 | TI | 56-QFN (8x8) | New | 详细 | |
| XTR111AIDGQT | TI | 10-MSOP-PowerPad | New | 详细 | |
| OMAP3530DZCBBA | TI | 515-POP-FCBGA (12x12) | New | 详细 | |
| OPA2363AIDGST | TI | 10-VSSOP | New | 详细 | |
| ADS7950SBRGET | TI | 24-VQFN (4x4) | New | 详细 | |
| SN74CB3T3383PWR | TI | 24-TSSOP | New | 详细 | |
| TLV2316IDGKR | TI | 8-VSSOP | New | 详细 | |
| LMX2512LQX0967 | TI | 28-WQFN (5x5) | New | 详细 | |
| SN10KHT5541DWR | TI | 24-SOIC | New | 详细 | |
| MSP430F5526IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| CD74HC423M | TI | 16-SOIC | New | 详细 | |
| MSP430F5329IPNR | TI | 80-LQFP (12x12) | New | 详细 | |
| TPS54395PWP | TI | 16-HTSSOP | New | 详细 | |
| LMV118MFX | TI | SOT-23-6 | New | 详细 | |
| LMV934IDE4 | TI | 14-SOIC | New | 详细 | |
| LM2662M | TI | 8-SOIC | New | 详细 | |
| SN65LVDT388DBTR | TI | 38-TSSOP | New | 详细 | |
| VSP5611RSHR | TI | 56-VQFN (7x7) | New | 详细 | |
| UCC28C44D | TI | 8-SOIC | New | 详细 |
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