产品系列

罗斌森
  • OMAP3530DZCBBA

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : OMAP-35xx
    Part Status : Obsolete
    Core Processor : ARM? Cortex?-A8
    Number of Cores/Bus Width : 1 Core, 32-Bit
    Speed : 720MHz
    Co-Processors/DSP : Signal Processing; C64x+, Multimedia; NEON? SIMD
    RAM Controllers : LPDDR
    Graphics Acceleration : Yes
    Display & Interface Controllers : LCD
    USB : USB 1.x (3), USB 2.0 (1)
    Voltage - I/O : 1.8V, 3.0V
    Operating Temperature : -40°C ~ 105°C (TJ)
    Package / Case : 515-VFBGA, FCBGA
    Supplier Device Package : 515-POP-FCBGA (12x12)

极速报价

型号
品牌 封装 批号 查看
OPA355UA/2K5 TI 8-SOIC New 详细
SN74LVCH32244AGKER TI 96-LFBGA (13.5x5.5) New 详细
TCM38C17IDL TI 48-SSOP New 详细
SN74LVC2G07DCKR TI SC-70-6 New 详细
OMAP5912ZDY TI 289-BGA (19x19) New 详细
LM3671TL-2.8/NOPB TI 5-DSBGA (1.41x1.08) New 详细
TL1453CNSR TI New 详细
LP3875EMP-2.5/NOPB TI SOT-223-5 New 详细
LMH0044SQX TI 16-WQFN (4x4) New 详细
TCAN1042VDQ1 TI 8-SOIC New 详细
SN74LV273AZQNR TI New 详细
TLVH431AQPK TI SOT-89-3 New 详细
SN74CBT6845CDBRE4 TI 20-SSOP New 详细
SN74F163ADR TI 16-SOIC New 详细
TPS3106E16DBVT TI SOT-23-6 New 详细
SN74LVC374AQPWRQ1 TI New 详细
TPS7B6950QDBVRQ1 TI SOT-23-5 New 详细
UCC28951QPWRQ1 TI 24-TSSOP New 详细
UC2848DWG4 TI 16-SOIC New 详细
LP3965ESX-2.5 TI DDPAK/TO-263-5 New 详细