罗斌森
罗斌森
  • TPS8268150SIPT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Discontinued at Digi-Key
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.5V
    Voltage - Input (Max) : 5.5V
    Voltage - Output 1 : 1.5V
    Current - Output (Max) : 1.6A
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 90%
    Mounting Type : Surface Mount
    Package / Case : 9-SMD Module
    Size / Dimension : 0.11" L x 0.09" W x 0.04" H (2.9mm x 2.3mm x 1.0mm)
    Supplier Device Package : 9-USIP

极速报价

型号
品牌 封装 批号 查看
LMV861MGE/NOPB TI SC-70-5 New 详细
TSU6111ARSVR TI 16-UQFN (2.6x1.8) New 详细
SN75LVDM976DLRG4 TI 56-SSOP New 详细
LM70CIMM-3/NOPB TI 8-VSSOP New 详细
TAS2521EVM TI New 详细
DRV8800RTYT TI 16-QFN (4x4) New 详细
LP3852EMP-5.0/NOPB TI SOT-223-5 New 详细
TPS3103K33DBVR TI SOT-23-6 New 详细
LM89-1CIMX/NOPB TI 8-SOIC New 详细
TLV705165YFPR TI 4-DSBGA (0.78x0.78) New 详细
LP2986IMMX-3.3/NOPB TI 8-VSSOP New 详细
PT5024S TI New 详细
ADS42JB46IRGCT TI 64-VQFN (9x9) New 详细
LM25101AMRX/NOPB TI New 详细
LM4674ATL/NOPB TI 16-DSBGA New 详细
F28M35E50B1RFPT TI 144-HTQFP (20x20) New 详细
LP2985-30DBVT TI SOT-23-5 New 详细
CD74AC257M96 TI 16-SOIC New 详细
MSP430F2481TPM TI 64-LQFP (10x10) New 详细
LMV7239QM7/NOPB TI SC-70-5 New 详细
 TOP