产品系列
MSP430FR59691IRGZR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430? FRAM
Part Status : Active
Core Processor : CPUXV2
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, IrDA, SCI, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 40
Program Memory Size : 64KB (64K x 8)
Program Memory Type : FRAM
RAM Size : 2K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 16x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV170IDR | TI | 8-SOIC | New | 详细 | |
| TPS40050PWPR | TI | 16-HTSSOP | New | 详细 | |
| LMV932MM/NOPB | TI | 8-VSSOP | New | 详细 | |
| PT78ST108V | TI | New | 详细 | ||
| SN74LVC04APWR | TI | 14-TSSOP | New | 详细 | |
| TPIC2050RDFDRG4 | TI | 56-HTSSOP | New | 详细 | |
| PT5501C | TI | New | 详细 | ||
| THS8083A95PZP | TI | 100-HTQFP (14x14) | New | 详细 | |
| SN74ACT241DW | TI | 20-SOIC | New | 详细 | |
| OMAPL137BZKBT3 | TI | 256-BGA (17x17) | New | 详细 | |
| LMV934MAX | TI | 14-SOIC | New | 详细 | |
| THS4503CDGN | TI | 8-MSOP-PowerPad | New | 详细 | |
| TPS62227DDCT | TI | SOT-23-5 | New | 详细 | |
| MSP430FR2311IRGYR | TI | 16-VQFN (4x3.5) | New | 详细 | |
| PTH04040WAS | TI | New | 详细 | ||
| TLC59281DBQ | TI | 24-SSOP/QSOP | New | 详细 | |
| TL081BCD | TI | 8-SOIC | New | 详细 | |
| OPA2209AIDGKT | TI | 8-VSSOP | New | 详细 | |
| TPS5432DDAR | TI | 8-SO PowerPad | New | 详细 | |
| SN74ALS857DWR | TI | 24-SOIC | New | 详细 |
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