产品系列
产品系列
OMAPL137BZKBT3
- Manufacturer : Texas Instruments
Packaging : Tray
Series : OMAP-L1x
Part Status : Obsolete
Core Processor : ARM926EJ-S
Number of Cores/Bus Width : 1 Core, 32-Bit
Speed : 375MHz
Co-Processors/DSP : Signal Processing; C674x, System Control; CP15
RAM Controllers : SDRAM
Graphics Acceleration : No
Display & Interface Controllers : LCD
Ethernet : 10/100 Mbps (1)
USB : USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O : 1.8V, 3.3V
Operating Temperature : -40°C ~ 125°C (TJ)
Package / Case : 256-BGA
Supplier Device Package : 256-BGA (17x17)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| VSP2260YG4 | TI | 48-LQFP (7x7) | New | 详细 | |
| LM3420AM5X-8.4 | TI | SOT-23-5 | New | 详细 | |
| LP3972SQE-E514/NOPB | TI | 40-WQFN (5x5) | New | 详细 | |
| LM3206TLX/NOPB | TI | 8-TuSMD | New | 详细 | |
| VCA824ID | TI | 14-SOIC | New | 详细 | |
| BQ2084DBTR-V133 | TI | 38-TSSOP | New | 详细 | |
| LM1086ILDX-ADJ/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| SN74LV393AD | TI | 14-SOIC | New | 详细 | |
| BQ24261RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| LM2576HVSX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM3208URX/NOPB | TI | 8-TuSMD | New | 详细 | |
| MSP430G2402IRSA16R | TI | 16-QFN (4x4) | New | 详细 | |
| TLC7528IPW | TI | 20-TSSOP | New | 详细 | |
| ADS8867IDRCT | TI | 10-VSON (3x3) | New | 详细 | |
| OPA858DSGEVM | TI | New | 详细 | ||
| UA78L05AID | TI | 8-SOIC | New | 详细 | |
| SN74AHC00N | TI | 14-PDIP | New | 详细 | |
| TMS320VC549GGU-100 | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| GC5328IZER | TI | 484-BGA (23x23) | New | 详细 | |
| ADS8372IRHPR | TI | 28-VQFN-EP (6x6) | New | 详细 |
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