产品系列
THS7315DR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Applications : Buffer
Output Type : Rail-to-Rail
Number of Circuits : 1
-3db Bandwidth : 8.5MHz
Current - Supply : 16.5mA
Current - Output / Channel : 90mA
Voltage - Supply, Single/Dual (±) : 2.85V ~ 5.25V
Mounting Type : Surface Mount
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74LS623NSR | TI | 20-SO | New | 详细 | |
| DS26LS32ACM | TI | 16-SOIC | New | 详细 | |
| TLV2464ID | TI | 14-SOIC | New | 详细 | |
| LP3963ET-3.3/NOPB | TI | TO-220-5 | New | 详细 | |
| MAX3223EIDBR | TI | 20-SSOP | New | 详细 | |
| OPA188AIDR | TI | 8-SOIC | New | 详细 | |
| TLC254CN | TI | 14-PDIP | New | 详细 | |
| LP3966ESX-2.5/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LP2988IM-3.0/NOPB | TI | 8-SOIC | New | 详细 | |
| TPS61050AYZGR | TI | 12-DSBGA | New | 详细 | |
| LP2989AIMMX-2.8/NOPB | TI | 8-VSSOP | New | 详细 | |
| SN751730D | TI | 16-SOIC | New | 详细 | |
| LM3S1811-IBZ50-C1T | TI | 108-BGA (10x10) | New | 详细 | |
| TPS62748YFPR | TI | 8-DSBGA | New | 详细 | |
| OMAPL138EZCE3 | TI | 361-NFBGA (13x13) | New | 详细 | |
| LM4879IBP/NOPB | TI | 8-uSMD | New | 详细 | |
| MSP430FR5736IRGET | TI | 24-VQFN (4x4) | New | 详细 | |
| LM5116BUCKEVM-BLDT | TI | New | 详细 | ||
| LM3S1G21-IBZ80-A1 | TI | 108-BGA (10x10) | New | 详细 | |
| LM2902LVIDR | TI | 14-SOIC | New | 详细 |
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