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  • THS7314DR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : Buffer
    Output Type : Rail-to-Rail
    Number of Circuits : 3
    Current - Supply : 16mA
    Current - Output / Channel : 70mA
    Voltage - Supply, Single/Dual (±) : 2.85V ~ 5.5V
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
TLV2783CD TI 14-SOIC New 详细
AM3352ZCE27 TI 298-NFBGA (13x13) New 详细
TPA6211A1DGN TI 8-MSOP-PowerPad New 详细
THS3112IDR TI 8-SOIC New 详细
TPS72515DCQ TI SOT-223-6 New 详细
TLV62150ARGTR TI New 详细
AMC1301QDWVQ1 TI 8-SOIC New 详细
UCC21220AD TI New 详细
CD74HCT154ENG4 TI 24-PDIP New 详细
LMH0344SQX/NOPB TI 16-WQFN (4x4) New 详细
SN74SSTU32866AZKER TI 96-PBGA MICROSTAR (13.6x5.6) New 详细
UC3573N TI 8-PDIP New 详细
SN74LV541APW TI 20-TSSOP New 详细
TIBPAL20L8-15CFN TI 28-PLCC (11.51x11.51) New 详细
LM5113LLPEVB/NOPB TI New 详细
CD4543BM TI 16-SOIC New 详细
SN65HVD101RGBT TI 20-VQFN (3.5x4) New 详细
LMV934IDRG4 TI 14-SOIC New 详细
MAX232N TI 16-PDIP New 详细
SCAN162602SM/NOPB TI 64-NFBGA (8x8) New 详细