产品系列
SN7407DRE4
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM5109SD | TI | 8-WSON (4x4) | New | 详细 | |
| TMP116METER-EVM | TI | New | 详细 | ||
| LM2575S-ADJ | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74LV165APW | TI | 16-TSSOP | New | 详细 | |
| TPS62406QDRCRQ1 | TI | 10-VSON (3x3) | New | 详细 | |
| LMX2337TMX | TI | 16-TSSOP | New | 详细 | |
| TMS320DM6433ZDU6 | TI | 376-BGA (23x23) | New | 详细 | |
| LP3984IBP-2.0/NOPB | TI | 4-DSBGA | New | 详细 | |
| LMZ34002RKGR | TI | 41-B1QFN (11x9) | New | 详细 | |
| SN74LVC1G32DBVT | TI | SOT-23-5 | New | 详细 | |
| ADC32RF82IRMPT | TI | 72-VQFN (10x10) | New | 详细 | |
| UCC2819ANG4 | TI | 16-PDIP | New | 详细 | |
| LMH6645MA/NOPB | TI | 8-SOIC | New | 详细 | |
| ADC3424EVM | TI | New | 详细 | ||
| LP2957ISX | TI | DDPAK/TO-263-5 | New | 详细 | |
| BQ4017YMC-70 | TI | 36-DIP Module (18.42x52.96) | New | 详细 | |
| SN65LBC173ADR | TI | 16-SOIC | New | 详细 | |
| LM4250CM | TI | 8-SOIC | New | 详细 | |
| DRV5023BIQLPGM | TI | TO-92-3 | New | 详细 | |
| TPIC7218QPFPRQ1 | TI | 80-HTQFP (12x12) | New | 详细 |
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