产品系列
S5LS10116ASPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Not For New Designs
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 140MHz
Connectivity : CANbus, LINbus, SCI, SPI, UART/USART
Peripherals : DMA, POR
Number of I/O : 68
Program Memory Size : 1MB (1M x 8)
Program Memory Type : FLASH
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.35V ~ 1.65V
Data Converters : A/D 20x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74ALS323DWRE4 | TI | 20-SOIC | New | 详细 | |
| TPL5110QDDCRQ1 | TI | TSOT-23-6 | New | 详细 | |
| LP38500SD-ADJ/NOPB | TI | 8-WSON (3x2.5) | New | 详细 | |
| TL1451CPWR | TI | 16-TSSOP | New | 详细 | |
| TL852CNE4 | TI | New | 详细 | ||
| SN74BCT646NT | TI | 24-PDIP | New | 详细 | |
| LP3879SDX-1.2/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| CLVC2G125IDCURQ1 | TI | US8 | New | 详细 | |
| TLV1117IKTTR | TI | DDPAK/TO-263-3 | New | 详细 | |
| TLV62569PEVM-884 | TI | New | 详细 | ||
| BQ24630RGET | TI | 24-VQFN (4x4) | New | 详细 | |
| 74ACT11257DW | TI | 20-SOIC | New | 详细 | |
| TLC59116EVM-390 | TI | New | 详细 | ||
| LP3988ITL-2.85/NOPB | TI | 5-DSBGA (1.41x1.08) | New | 详细 | |
| TPS22912CEVM-656 | TI | New | 详细 | ||
| TNETV2685FIBZUTA7 | TI | 529-FCBGA (19x19) | New | 详细 | |
| LM3S8538-EQC50-A2 | TI | 100-LQFP (14x14) | New | 详细 | |
| LP2901DR | TI | 14-SOIC | New | 详细 | |
| LM3S9997-IQC80-C0T | TI | 100-LQFP (14x14) | New | 详细 | |
| MSC1201Y2RHHR | TI | 36-VQFN (6x6) | New | 详细 |
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