产品系列
S4MF03107SPZQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : Automotive, AEC-Q100, Hercules? TMS470M ARM? Cortex?-M3
Part Status : Active
Core Processor : ARM? Cortex?-M3
Core Size : 16/32-Bit
Speed : 80MHz
Connectivity : CANbus, LINbus, SCI, SPI, UART/USART
Peripherals : POR, WDT
Number of I/O : 49
Program Memory Size : 320KB (320K x 8)
Program Memory Type : FLASH
RAM Size : 16K x 8
Voltage - Supply (Vcc/Vdd) : 1.4V ~ 1.7V
Data Converters : A/D 16x10b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 100-LQFP
Supplier Device Package : 100-LQFP (14x14)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DLP-RF430BP | TI | New | 详细 | ||
| CD4572UBMTE4 | TI | 16-SOIC | New | 详细 | |
| PCI2050PDV | TI | 208-LQFP | New | 详细 | |
| TPS54528EVM-052 | TI | New | 详细 | ||
| CSD16407Q5C | TI | 8-VSON-CLIP (5x6) | New | 详细 | |
| CD74HC4060PWR | TI | 16-TSSOP | New | 详细 | |
| CLVTH16373IZQLREP | TI | 56-BGA MICROSTAR JUNIOR (7.0x4.5) | New | 详细 | |
| TPS60133PWP | TI | 20-HTSSOP | New | 详细 | |
| SN74ALS273NSR | TI | New | 详细 | ||
| LMZ31710X2EVM | TI | New | 详细 | ||
| MSP430F5517IPNR | TI | 80-LQFP (12x12) | New | 详细 | |
| TLV2361IDBVRE4 | TI | SOT-23-5 | New | 详细 | |
| LM3448-120VFLBK/NOPB | TI | New | 详细 | ||
| LP3985ITL-2.9/NOPB | TI | 5-DSBGA (1.41x1.08) | New | 详细 | |
| LP2957ISX | TI | DDPAK/TO-263-5 | New | 详细 | |
| TMX5700914PGEQQ1 | TI | 144-QFP (20x20) | New | 详细 | |
| UA723CN | TI | 14-PDIP | New | 详细 | |
| TPS76750QPWPRQ1 | TI | 20-HTSSOP | New | 详细 | |
| TPS7201QD | TI | 8-SOIC | New | 详细 | |
| UCC2813PW-5 | TI | 8-TSSOP | New | 详细 |
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