产品系列

罗斌森
罗斌森
  • LMV551MGX/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Amplifier Type : General Purpose
    Number of Circuits : 1
    Output Type : Rail-to-Rail
    Slew Rate : 1V/μs
    Gain Bandwidth Product : 3MHz
    Current - Input Bias : 20nA
    Voltage - Input Offset : 1mV
    Current - Supply : 37μA
    Current - Output / Channel : 25mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 5-TSSOP, SC-70-5, SOT-353
    Supplier Device Package : SC-70-5

极速报价

型号
品牌 封装 批号 查看
SN74F241DWRE4 TI 20-SOIC New 详细
ADS4129IRGZ25 TI 48-VQFN (7x7) New 详细
XIO2200GGW TI 176-BGA MICROSTAR (15x15) New 详细
SN75189AD TI 14-SOIC New 详细
SN74LVTH16373GQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
SN74ALVCH16374DGGR TI New 详细
MSP430FE427IPM TI 64-LQFP (10x10) New 详细
TRSF3223EIDWG4 TI 20-SOIC New 详细
TVP5151ZQC TI 48-BGA MICROSTAR JUNIOR (4x4) New 详细
UCC381DPTR-3 TI 8-SOIC New 详细
SN74GTLP2033ZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
LMH6722MT TI 14-TSSOP New 详细
UCC27200ADRMR TI 8-VSON (4x4) New 详细
TLV2442QPW TI 8-TSSOP New 详细
LM358P TI 8-PDIP New 详细
BQ2057DGKRG4 TI 8-VSSOP New 详细
TLV320AIC1109PBS TI 32-TQFP (5x5) New 详细
UC282TDKTTT-2G3 TI DDPAK/TO-263-5 New 详细
UCC27210DDAR TI 8-SO PowerPad New 详细
TLC372IDR TI 8-SOIC New 详细
 TOP