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  • MSP430G2533IPW20

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430G2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, PWM, WDT
    Number of I/O : 16
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-TSSOP (0.173", 4.40mm Width)
    Supplier Device Package : 20-TSSOP

极速报价

型号
品牌 封装 批号 查看
UCC28528EVM TI New 详细
TMP006BIYZFT TI 8-DSBGA New 详细
TAS5414BTPHDQ1 TI 64-HTQFP (14x14) New 详细
UA733CNSR TI 14-SOP New 详细
TPS799L54YZYT TI 5-DSBGA New 详细
DS3896M TI 20-SOIC New 详细
LM94022BIMG TI SC-70-5 New 详细
SN74LV373APWRG4 TI 20-TSSOP New 详细
UCC39151DPTR TI 16-SOIC New 详细
TS3A27518EPWR TI 24-TSSOP New 详细
TSC2300IPAGRG4 TI 64-TQFP (10x10) New 详细
TL7770-5CDWR TI 16-SOIC New 详细
SN74CB3T3125PWR TI 14-TSSOP New 详细
DRV8320RHRHAR TI 40-VQFN (6x6) New 详细
AM1808BZCE4 TI 361-NFBGA (13x13) New 详细
LM431BCM3X/NOPB TI SOT-23-3 New 详细
TMS320DM369ZCED TI 338-NFBGA (13x13) New 详细
BQ24725ARGRT TI 20-VQFN (3.5x3.5) New 详细
TLV7011-2-3-41EVM TI New 详细
LM3S6918-IBZ50-A2T TI 108-BGA (10x10) New 详细