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  • MSP430FG4617IZQWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : CPUX
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    Number of I/O : 80
    Program Memory Size : 92KB (92K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b; D/A 2x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 113-VFBGA
    Supplier Device Package : 113-BGA Microstar Junior (7x7)

极速报价

型号
品牌 封装 批号 查看
LM2576T-5.0/NOPB TI TO-220-5 New 详细
TLV8802DGKR TI 8-VSSOP New 详细
ADS5562IRGZT TI 48-VQFN (7x7) New 详细
UCC28502DWTR TI 20-SOIC New 详细
DRV8703QRHBTQ1 TI 32-VQFN (5x5) New 详细
UCD7100PWPR TI 14-HTSSOP New 详细
SN75LBC775DWG4 TI 20-SOIC New 详细
ISO7821LLDWWR TI 16-SOIC New 详细
DS25BR120TSD/NOPB TI 8-WSON (3x3) New 详细
LP2985A-33DBVR TI SOT-23-5 New 详细
TPA3132D2RHBT TI 32-VQFN (5x5) New 详细
SN74AVCH4T245DR TI 16-SOIC New 详细
LP2985AIM5X-2.7 TI SOT-23-5 New 详细
SN74LVC2G86DCUTE4 TI US8 New 详细
INA2143UA TI 14-SOIC New 详细
TPS75901KTTT TI DDPAK/TO-263-5 New 详细
TLE2024CDW TI 16-SOIC New 详细
TMS32C6713BZDPA200 TI 272-BGA (27x27) New 详细
UCC38086PWG4 TI 8-TSSOP New 详细
TPS62650YFFR TI 9-DSBGA (1.2x1.3) New 详细