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  • MSP430F5526IYFFT

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Obsolete
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 96KB (96K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-UFBGA, DSBGA
    Supplier Device Package : 64-DSBGA

极速报价

型号
品牌 封装 批号 查看
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SN74ALS876ADW TI New 详细
LMK61A2-644M53SIAT TI 6-QFM (7x5) New 详细
BQ25606EVM-772 TI New 详细
TLV70242PDSER TI 6-WSON (1.5x1.5) New 详细
CD4522BE TI 16-PDIP New 详细
TLV2773ING4 TI 14-PDIP New 详细
LM3S1439-EQC50-A2T TI 100-LQFP (14x14) New 详细
LM8342SDX TI 10-WSON (3x3) New 详细
LP2992ILDX-1.8/NOPB TI 6-WSON (2.92x3.29) New 详细
SN74AHCT244QPWRQ1 TI 20-TSSOP New 详细
TPD2E001DRLR TI SOT-5 New 详细
LM3S5G31-IQC80-A1 TI 100-LQFP (14x14) New 详细
CD40193BPWR TI 16-TSSOP New 详细
SN74AUP1T98DSFR TI 6-SON (1x1) New 详细
X66AK2H12AAW24 TI 1517-FCBGA (40x40) New 详细
LP3874ESX-3.3 TI DDPAK/TO-263-5 New 详细