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  • MSP430F5508IRGZR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 31
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
TLC3544CDW TI 20-SOIC New 详细
TMDX570LS31CNCD TI New 详细
MM5483V TI 44-PLCC (16.58x16.58) New 详细
ADS5525IRGZ25 TI 48-VQFN (7x7) New 详细
SN74LS390DR TI 16-SOIC New 详细
HPA00420RGVR TI 16-VQFN (4x4) New 详细
TPS2553DDBVR TI SOT-23-6 New 详细
LM113H/NOPB TI TO-2 New 详细
SN75LVDT386DGGR TI 64-TSSOP New 详细
LM4930ITL/NOPB TI 36-μSMD (3.23x3.41) New 详细
LMK04208NKDT TI 64-WQFN (9x9) New 详细
TPD4E001QDBVRQ1 TI SOT-23-6 New 详细
SN74HC153PW TI 16-TSSOP New 详细
LM4681SQX/NOPB TI 48-WQFN (7x7) New 详细
SN75LVDS83CZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
TLE2074CN TI 14-PDIP New 详细
DAC7545GLURG4 TI 20-SOIC New 详细
SN74AS174DRG4 TI New 详细
LM9076QBMAX-3.3/NOPB TI 8-SOIC New 详细
TPA0243DGQR TI 10-MSOP-PowerPad New 详细