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  • MSP430F5419IPZ

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Not For New Designs
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 18MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 87
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 16K x 8
    Voltage - Supply (Vcc/Vdd) : 2.2V ~ 3.6V
    Data Converters : A/D 16x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 100-LQFP
    Supplier Device Package : 100-LQFP (14x14)

极速报价

型号
品牌 封装 批号 查看
DEM-OPA-TSSOP-4A TI New 详细
SN74AC574PW TI New 详细
TS3A5017QRGYRQ1 TI 16-VQFN (4x3.5) New 详细
LM4132EMF-4.1/NOPB TI SOT-23-5 New 详细
LM3670MF-1.5/NOPB TI SOT-23-5 New 详细
TLK2701IRCP TI 64-HVQFP New 详细
HPC3130APBK TI 128-LQFP (14x14) New 详细
MSP430F4250IDLR TI 48-SSOP New 详细
VSP10T21PFB TI 48-TQFP (7x7) New 详细
TL4051C12IDBZR TI SOT-23-3 New 详细
TPS7A8400ARGRR TI 20-VQFN (3.5x3.5) New 详细
UCC2808AD-2 TI 8-SOIC New 详细
SN74S85NSR TI New 详细
PCM2900BDBR TI 28-SSOP New 详细
LP3907SQ-PXPP/NOPB TI 24-WQFN (4x4) New 详细
LM48861TMBD TI New 详细
LP38858SX-0.8 TI DDPAK/TO-263-5 New 详细
LM2576S-3.3 TI DDPAK/TO-263-5 New 详细
OPA277U/2K5 TI 8-SOIC New 详细
CD74HCT241E TI 20-PDIP New 详细