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  • MSP430F5324IRGCT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 47
    Program Memory Size : 64KB (64K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
TLC2264AIDR TI 14-SOIC New 详细
TPS3850H12DRCT TI 10-VSON (3x3) New 详细
CSD97396Q4M TI 8-VSON (3.5x4.5) New 详细
SN74ALS373ADWR TI 20-SOIC New 详细
LM3S5D91-IQC80-A1T TI 100-LQFP (14x14) New 详细
TPS259230DRCR TI 10-VSON (3x3) New 详细
TPS77450DGK TI 8-VSSOP New 详细
SN74LS174NSR TI New 详细
SN74ABT8952DL TI 28-SSOP New 详细
TPS3851G33SDRBR TI 8-SON (3x3) New 详细
TUSB211QRWBRQ1 TI 12-X2QFN (1.6x1.6) New 详细
SN74ABT823NSRG4 TI New 详细
LM3S1816-IQR50-C0 TI 64-LQFP (10x10) New 详细
UCC2800QDRQ1 TI 8-SOIC New 详细
VSP3200YG4 TI 48-LQFP (7x7) New 详细
INA148UA/2K5G4 TI 8-SOIC New 详细
PT5026J TI New 详细
LM2676S-3.3 TI DDPAK/TO-263-7 New 详细
TPSM84205EAB TI 3-SIP Module New 详细
SN74LS298DG4 TI 16-SOIC New 详细