产品系列

罗斌森
  • MSP430F5257IRGCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 53
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 16K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
DS125BR800SQE/NOPB TI 54-WQFN (10x5.5) New 详细
LP38851SX-ADJ TI DDPAK/TO-263-7 New 详细
LM3S5R31-IQC80-C3T TI 100-LQFP (14x14) New 详细
LM3S801-IQN50-C2T TI 48-LQFP (7x7) New 详细
TAS5766MDCAEVM TI New 详细
TMS320DM355CZCEA13 TI 337-NFBGA (13x13) New 详细
UCC2818AQDRQ1 TI 16-SOIC New 详细
TMDXEVM8148 TI New 详细
CSD17577Q5A TI 8-VSONP (5x6) New 详细
LM3S5P31-IQC80-C3T TI 100-LQFP (14x14) New 详细
TL432QDBVR TI SOT-23-5 New 详细
LM2574HVMX-ADJ/NOPB TI 14-SOIC New 详细
LP5904TME-3.1/NOPB TI 4-DSBGA (0.81x0.81) New 详细
SN74ALS1035NSRE4 TI 14-SOP New 详细
LM5642XMH TI 28-HTSSOP New 详细
BQ27000DRKRG4 TI 10-VSON (3x4) New 详细
LM3S9GN5-IQC80-A2T TI 100-LQFP (14x14) New 详细
LM2733XMF TI SOT-23-5 New 详细
LM3S300-EQN25-C2T TI 48-LQFP (7x7) New 详细
LM2735XMY/NOPB TI 8-MSOP-EP New 详细