产品系列

罗斌森
  • MSP430F5132IDA

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : MSP430F5xx
    Part Status : Active
    Core Processor : CPUXV2
    Core Size : 16-Bit
    Speed : 25MHz
    Connectivity : I2C, IrDA, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 29
    Program Memory Size : 8KB (8K x 8)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 10x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 38-TSSOP (0.240", 6.10mm Width)
    Supplier Device Package : 38-TSSOP

极速报价

型号
品牌 封装 批号 查看
SN75LBC786DWG4 TI 28-SOIC New 详细
SN74LV244ADWR TI 20-SOIC New 详细
LMR64010XMFE/NOPB TI SOT-23-5 New 详细
THS3110CDGN TI 8-MSOP-PowerPad New 详细
DS90C363BMT TI 48-TSSOP New 详细
LM4040D30IDCKR TI SC-70-5 New 详细
LM4040CIM3-2.5 TI SOT-23-3 New 详细
BQ6400RGZR TI 48-VQFN (7x7) New 详细
AFE5807EVM TI New 详细
LP2967IBPX-1833 TI 8-uSMD New 详细
MSP430FR5739IDAR TI 38-TSSOP New 详细
DV2057C TI New 详细
LM10524EVM TI New 详细
MSP430F2013QRSATEP TI 16-QFN (4x4) New 详细
TPS560430XFDBVT TI SOT-23-6 New 详细
TRS3232IPWR TI 16-TSSOP New 详细
LP2985A-28DBVRE4 TI SOT-23-5 New 详细
THS1030CDW TI 28-SOIC New 详细
TUSB8020BEVM TI New 详细
LP3875ES-2.5 TI DDPAK/TO-263-5 New 详细