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  • MSP430F2330TRHAT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 8KB (8K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 40-VFQFN Exposed Pad
    Supplier Device Package : 40-VQFN (6x6)

极速报价

型号
品牌 封装 批号 查看
TPS3600D33PW TI 14-TSSOP New 详细
MAX232ECDR TI 16-SOIC New 详细
TPS7A0530PDQNT TI 4-X2SON (1x1) New 详细
HDC1080EVM TI New 详细
UCC3806DW TI 16-SOIC New 详细
LP3906SQX-VPFP/NOPB TI 24-WQFN (4x5) New 详细
TRS3243IPWR TI 28-TSSOP New 详细
DAC5689IRGCT TI 64-VQFN (9x9) New 详细
TRS3222IPWRG4 TI 20-TSSOP New 详细
SN74AUP2G08DCUR TI US8 New 详细
SN74LVCC3245APWRE4 TI 24-TSSOP New 详细
SN74AVCH2T45DCTT TI SM8 (SSOP) New 详细
LT1013DID TI 8-SOIC New 详细
LM2592HVSX-3.3 TI DDPAK/TO-263-5 New 详细
MSP432P401MIPZ TI 100-LQFP (14x14) New 详细
TPS62352YZGR TI 12-DSBGA New 详细
LP3963ES-5.0/NOPB TI DDPAK/TO-263-5 New 详细
TLV2782IDGKR TI 8-VSSOP New 详细
TPS72118DBVR TI SOT-23-5 New 详细
LM3677TLX-ADJ/NOPB TI 5-DSBGA (1.41x1.08) New 详细