产品系列

罗斌森
  • MSP430F2274IYFFR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 1K x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 49-UFBGA, DSBGA
    Supplier Device Package : 49-DSBGA (2.8x2.8)

极速报价

型号
品牌 封装 批号 查看
SN74LVC1G139DCTR TI SM8 (SSOP) New 详细
LP3971SQX-2G16/NOPB TI 40-WQFN (5x5) New 详细
SN74LVC1T45DBVRG4 TI SOT-23-6 New 详细
ISO1176EVM TI New 详细
SN65HVD1471DR TI 8-SOIC New 详细
TLC2254AIDR TI 14-SOIC New 详细
CD74HCT574QPWREP TI New 详细
2U3836H30QDBVRG4Q1 TI SOT-23-5 New 详细
SN761666DGKG4 TI 8-VSSOP New 详细
TLC5942RHBT TI 32-VQFN (5x5) New 详细
LM27402MHX/NOPB TI 16-HTSSOP New 详细
UC2886D TI 16-SOIC New 详细
TPS2559EVM-624 TI New 详细
TSB43DA42AZHCR TI 196-BGA MICROSTAR (15x15) New 详细
TRF372017IRGZT TI New 详细
INA212BIRSWR TI 10-UQFN (1.8x1.4) New 详细
SN65HVD266DR TI 8-SOIC New 详细
OPA2314AIDGK TI 8-VSSOP New 详细
ADC0816CCN TI 40-DIP New 详细
LM4F232H5BBFIGR TI 157-BGA MicroStar Jr (9x9) New 详细