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  • MSP430F2254IDAR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, IrDA, LINbus, SCI, SPI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 16KB (16K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 12x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 38-TSSOP (0.240", 6.10mm Width)
    Supplier Device Package : 38-TSSOP

极速报价

型号
品牌 封装 批号 查看
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MSP430U275IPMG4 TI 64-LQFP (10x10) New 详细
TCA9546APWR TI 16-TSSOP New 详细
TLV2372ID TI 8-SOIC New 详细
LMV931MG TI SC-70-5 New 详细
ADS1286PB TI 8-PDIP New 详细
CY74FCT16244CTPVCT TI 48-SSOP New 详细
ADS6144IRHBT TI 32-VQFN (5x5) New 详细
SN75ALS171DWR TI 20-SOIC New 详细
TS5N118PWR TI 16-TSSOP New 详细
OPA4377AQPWRQ1 TI 14-TSSOP New 详细
LM2936HVBMA-3.0/NOPB TI 8-SOIC New 详细
LP38869EVAL/NOPB TI New 详细
TM4C123GH6PZI TI 100-LQFP (14x14) New 详细
TLV75515PDQNR TI 4-X2SON (1x1) New 详细
MPA4609IPFBR TI 48-TQFP (7x7) New 详细
SN74GTL16616DLR TI 56-SSOP New 详细
CD4555BM TI 16-SOIC New 详细
BQ4852YMC-85 TI 36-DIP Module (18.42x52.96) New 详细