产品系列

罗斌森
  • MSP430F2111TDWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 16
    Program Memory Size : 2KB (2K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 128 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 20-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 20-SOIC

极速报价

型号
品牌 封装 批号 查看
TMP432ADGST TI 10-VSSOP New 详细
SN74V245-15PAG TI 64-TQFP (10x10) New 详细
SN74AUC1GU04YEAR TI 5-DSBGA, 5-WCSP (1.4x0.9) New 详细
DLP6500FLQ TI 203-CLGA (40.64x31.75) New 详细
SN74ALVTH16827DLR TI 56-SSOP New 详细
LM3445-208277EV/NOPB TI New 详细
LM2671M-3.3/NOPB TI 8-SOIC New 详细
LMZ12003DEMO/NOPB TI New 详细
DS90LV028AHM/NOPB TI 8-SOIC New 详细
SN74GTLPH16612DLR TI 56-SSOP New 详细
BQ2057TS TI 8-TSSOP New 详细
SN65LVDS9637DGK TI 8-VSSOP New 详细
OPA365AMDBVTEP TI SOT-23-5 New 详细
LMH6609MFX TI SOT-23-5 New 详细
UCC3941DTR-3 TI 8-SOIC New 详细
TPIC46L02DB TI 28-SSOP New 详细
SN74LV595ADR TI 16-SOIC New 详细
TPS61031PWPR TI 16-HTSSOP New 详细
TPS76601DR TI 8-SOIC New 详细
LM2597HVN-ADJ/NOPB TI 8-PDIP New 详细