产品系列

罗斌森
  • MSP430F2003TRSAT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430F2xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 16MHz
    Connectivity : I2C, SPI
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 10
    Program Memory Size : 1KB (1K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 128 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 10x16b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 16-VQFN Exposed Pad
    Supplier Device Package : 16-QFN (4x4)

极速报价

型号
品牌 封装 批号 查看
TLC2274CDR TI 14-SOIC New 详细
TLVH431CDBZT TI SOT-23-3 New 详细
LM5160DNTJ TI 12-WSON (4x4) New 详细
SN761672ADA TI 32-TSSOP New 详细
BQ29703DSER TI 6-WSON (1.5x1.5) New 详细
PT6706A TI New 详细
TMS320C54V90GGU TI 144-BGA MICROSTAR (12x12) New 详细
RI-I02-114A-S1 TI New 详细
TRSF3223CDWG4 TI 20-SOIC New 详细
TPS61170DRVRG4 TI New 详细
LP2981AIM5-3.2/NOPB TI SOT-23-5 New 详细
TPS3851G50SDRBR TI 8-SON (3x3) New 详细
LM25019SD/NOPB TI 8-WSON (4x4) New 详细
LP38856SX-0.8 TI DDPAK/TO-263-5 New 详细
NE5534PSRE4 TI 8-SO New 详细
LM185BXH-2.5 TI TO-2 New 详细
SN75ALS194DR TI 16-SOIC New 详细
LP2985IM5X-2.0/NOPB TI SOT-23-5 New 详细
BQ24155RGYT TI 14-VQFN (3.5x3.5) New 详细
MAX202IDW TI 16-SOIC New 详细