产品系列
MSP430F2003IPWR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430F2xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 16MHz
Connectivity : I2C, SPI
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 10
Program Memory Size : 1KB (1K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 128 x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 10x16b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package : 14-TSSOP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV70025DCKT | TI | SC-70-5 | New | 详细 | |
| CD74HC157M96 | TI | 16-SOIC | New | 详细 | |
| LM1973N/NOPB | TI | 20-DIP | New | 详细 | |
| TPS54386EVM | TI | New | 详细 | ||
| LP2986IMX-3.3 | TI | 8-SOIC | New | 详细 | |
| LM2595SX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74ACT32PW | TI | 14-TSSOP | New | 详细 | |
| SN75189AD | TI | 14-SOIC | New | 详细 | |
| LM8323JGR8AXM/NOPB | TI | 36-CSBGA (3.5x3.5) | New | 详细 | |
| BQ4015MA-70 | TI | 32-DIP Module (18.42x42.8) | New | 详细 | |
| TAS5601DCAR | TI | 56-HTSSOP | New | 详细 | |
| TL4051B12IDBZR | TI | SOT-23-3 | New | 详细 | |
| TLC2272QPWRG4 | TI | 8-TSSOP | New | 详细 | |
| CD74ACT573M | TI | 20-SOIC | New | 详细 | |
| LM5100BMA/NOPB | TI | 8-SOIC | New | 详细 | |
| TPS73533QDRBRQ1 | TI | 8-SON (3x3) | New | 详细 | |
| TPA0253DGQR | TI | 10-MSOP-PowerPad | New | 详细 | |
| LP3990MF-3.3 | TI | SOT-23-5 | New | 详细 | |
| MAX232ECD | TI | 16-SOIC | New | 详细 | |
| L293NE | TI | 16-PDIP | New | 详细 |
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