产品系列
MSP430F157IRTDT
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MSP430x1xx
Part Status : Active
Core Processor : MSP430
Core Size : 16-Bit
Speed : 8MHz
Connectivity : I2C, SPI, UART/USART
Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O : 48
Program Memory Size : 32KB (32K x 8 + 256B)
Program Memory Type : FLASH
RAM Size : 1K x 8
Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
Data Converters : A/D 8x12b; D/A 2x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 85°C (TA)
Mounting Type : Surface Mount
Package / Case : 64-VFQFN Exposed Pad
Supplier Device Package : 64-VQFN (9x9)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TLV73312PDQNR | TI | 4-X2SON (0.8x0.8) | New | 详细 | |
| TPS65101RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| LP2992AIM5X-3.3 | TI | SOT-23-5 | New | 详细 | |
| TPS2150IPWPR | TI | 14-HTSSOP | New | 详细 | |
| LP2985ITPX-3.3/NOPB | TI | 5-DSBGA | New | 详细 | |
| TPS2055AD | TI | 8-SOIC | New | 详细 | |
| ADS5237IPAGT | TI | 64-TQFP (10x10) | New | 详细 | |
| BQ28Z610EVM-532 | TI | New | 详细 | ||
| ADC121C02XEB/NOPB | TI | New | 详细 | ||
| LP2986IMM-3.3 | TI | 8-VSSOP | New | 详细 | |
| TAS3103ADBTG4 | TI | 38-TSSOP | New | 详细 | |
| LM2937ES-5.0 | TI | DDPAK/TO-263-3 | New | 详细 | |
| CABT16245AMDLREP | TI | 48-SSOP | New | 详细 | |
| TMS320F2811PBKS | TI | 128-LQFP (14x14) | New | 详细 | |
| MSP430G2453IPW20 | TI | 20-TSSOP | New | 详细 | |
| MSC1211Y3PAGT | TI | 64-TQFP (10x10) | New | 详细 | |
| ADS5541IPAP | TI | 64-HTQFP (10x10) | New | 详细 | |
| TLV320AIC34EVM-K | TI | New | 详细 | ||
| TPS74201KTWTG3 | TI | DDPAK/TO-263-7 | New | 详细 | |
| SN74ALS666DWRE4 | TI | 24-SOIC | New | 详细 |
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