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  • MSP430F135IRTDT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Connectivity : SPI, UART/USART
    Peripherals : POR, PWM, WDT
    Number of I/O : 48
    Program Memory Size : 16KB (16K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 512 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 8x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-VFQFN Exposed Pad
    Supplier Device Package : 64-VQFN (9x9)

极速报价

型号
品牌 封装 批号 查看
SN65LVDT33DR TI 16-SOIC New 详细
ISO7631FCDW TI 16-SOIC New 详细
SN74AUP1G97DBVR TI SOT-23-6 New 详细
LM2682MMX TI 8-VSSOP New 详细
CD74HC4002NSRE4 TI 14-SOP New 详细
LM2575HVS-5.0/NOPB TI DDPAK/TO-263-5 New 详细
LM3S9L71-IQC80-C3 TI 100-LQFP (14x14) New 详细
TLV1548QDBREP TI 20-SSOP New 详细
SN74ALVC16834DGVR TI 56-TVSOP New 详细
74GTLP2034DGVRG4 TI 48-TVSOP New 详细
TPS75103YFFR TI 9-DSBGA (1.2x1.3) New 详细
SN74AS638ANSR TI 20-SO New 详细
TPS54519RTET TI 16-WQFN (3x3) New 详细
TPS60500DGS TI 10-VSSOP New 详细
UCC2813D-4 TI 8-SOIC New 详细
CD74FCT245M TI 20-SOIC New 详细
LM50CIM3X/NOPB TI SOT-23-3 New 详细
LMX2522LQX1635 TI 28-WQFN (5x5) New 详细
TMS320VC5510AGGWA1 TI 240-BGA MicroStar (15x15) New 详细
LM3S3654-IQR50-C5T TI 64-LQFP (10x10) New 详细