罗斌森
  • LP38788SDE-ADJ/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 12-VFDFN Exposed Pad
    Supplier Device Package : 12-WSON (4x4)

极速报价

型号
品牌 封装 批号 查看
LMZ31506HRUQT TI 47-B1QFN (15x9) New 详细
TSC2101IRGZ TI 48-VQFN (7x7) New 详细
DS10CP154ATSQX/NOPB TI 40-WQFN (6x6) New 详细
TPS61253AYFFT TI 9-DSBGA (1.2x1.3) New 详细
UCC2813QDR-3Q1 TI 8-SOIC New 详细
TPS79945YZUR TI 5-DSBGA (1x1.37) New 详细
LMX1511TMX TI 20-TSSOP New 详细
74FCT162H501CTPACT TI 56-TSSOP New 详细
OPA2196IDGKR TI 8-VSSOP New 详细
LM2661/3/4EVAL TI New 详细
DCP022405P TI 7-PDIP New 详细
PT5103J TI New 详细
UCC38084PWR TI 8-TSSOP New 详细
ADS8556IPM TI 64-LQFP (10x10) New 详细
CD74HCT139MT TI 16-SOIC New 详细
TUSB211PICO-EVM TI New 详细
TPS77033DBVR TI SOT-23-5 New 详细
OPA4350EA/250 TI 16-SSOP New 详细
LM90CIMMX TI 8-VSSOP New 详细
TPS72733YFFR TI 4-DSBGA (1x1) New 详细