产品系列

罗斌森
  • LMV881LEE/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 1
    Output Type : Rail-to-Rail
    Slew Rate : 12V/μs
    Gain Bandwidth Product : 23MHz
    Current - Input Bias : 0.1pA
    Voltage - Input Offset : 273μV
    Current - Supply : 1.9mA
    Current - Output / Channel : 70mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 6-UFDFN
    Supplier Device Package : 6-USON (1.5x1)

极速报价

型号
品牌 封装 批号 查看
ADS54J64IRMP TI 72-VQFN (10x10) New 详细
DRV8848PWPR TI 16-HTSSOP New 详细
VSP5611RSHR TI 56-VQFN (7x7) New 详细
CD74ACT273MPWREP TI New 详细
SN75C3221PWR TI 16-TSSOP New 详细
SN75LBC771DW TI 20-SOIC New 详细
LM5175PWPR TI 28-HTSSOP New 详细
SN74HCT573PW TI 20-TSSOP New 详细
TLV76050DBZT TI SOT-23-3 New 详细
BQ24041DSQR TI 10-WSON (2x2) New 详细
LM3S316-IQN25-C2T TI 48-LQFP (7x7) New 详细
TPS2371D TI 8-SOIC New 详细
SN74AHCT573N TI 20-PDIP New 详细
CD74HCT257M TI 16-SOIC New 详细
DM3730CBC100 TI 515-POP-FCBGA (14x14) New 详细
TPS650830ZAJT TI 168-NFBGA (7x7) New 详细
TL062IDR TI 8-SOIC New 详细
SN74AHCT573DWR TI 20-SOIC New 详细
LM4040D30IDCKR TI SC-70-5 New 详细
XOMAP3525BCUS TI 423-FCBGA (16x16) New 详细