产品系列

罗斌森
  • LMK01801BISQE/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Fanout Buffer (Distribution), Divider, Multiplexer
    Number of Circuits : 2
    Ratio - Input:Output : 1:8, 1:6
    Differential - Input:Output : Yes/Yes
    Input : LVCMOS, LVDS, LVPECL, RF Sinewave
    Output : LVCMOS, LVDS, LVPECL
    Frequency - Max : 3.1GHz
    Voltage - Supply : 3.15V ~ 3.45V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 48-WFQFN Exposed Pad
    Supplier Device Package : 48-WQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
TLV716120275PDPQR TI 6-X2SON (1.2x1.2) New 详细
SN74AUP1G240DPWR TI 5-X2SON (0.80x0.80) New 详细
BQ27741YZFR-G1 TI 15-DSBGA New 详细
TPSM84A21MOJT TI 20-QFM (9x15) New 详细
SN74LV245ADW TI 20-SOIC New 详细
CSD17555Q5A TI 8-VSONP (5x6) New 详细
SN74LVTH241NSRG4 TI 20-SO New 详细
INA2128U TI 16-SOIC New 详细
TLC3541IDGK TI 8-VSSOP New 详细
SN74F299NSR TI 20-SO New 详细
SN75188N TI 14-PDIP New 详细
LM27403SQ/NOPB TI 24-WQFN (4x4) New 详细
TLC1541IN TI 20-PDIP New 详细
TAS5112DFDRG4 TI 56-HTSSOP New 详细
X5LS20216SPGEQQ1 TI 144-LQFP (20x20) New 详细
F28M35E52C1RFPT TI 144-HTQFP (20x20) New 详细
UA9638CDR TI 8-SOIC New 详细
SN74BCT2240N TI 20-PDIP New 详细
LMZM33602RLRR TI 18-B2QFN (9x7) New 详细
MSP430F110IDW TI 20-SOIC New 详细