产品系列

罗斌森
  • LMP7702MMX

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : LMP?
    Part Status : Obsolete
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 1.1V/μs
    Gain Bandwidth Product : 2.5MHz
    Current - Input Bias : 0.2pA
    Voltage - Input Offset : 37μV
    Current - Supply : 1.7mA
    Current - Output / Channel : 86mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 12V, ±1.35V ~ 6V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
    Supplier Device Package : 8-VSSOP

极速报价

型号
品牌 封装 批号 查看
LMC7211AIM5 TI SOT-23-5 New 详细
TLV2455CPWRG4 TI 16-TSSOP New 详细
REG1117F-3.3/500 TI DDPAK/TO-263-3 New 详细
REG103GA-3/2K5 TI SOT-223-6 New 详细
LM3621MX TI 16-SOIC New 详细
SN74ALVCH162601DLR TI 56-SSOP New 详细
BQ2040EVM-001 TI New 详细
TPS63001DRCT TI 10-VSON (3x3) New 详细
BQ29415PWG4 TI 8-TSSOP New 详细
TMS320DM641AZNZ5 TI 548-FCBGA (27x27) New 详细
MAX3243EIDWR TI 28-SOIC New 详细
SN74CBT3126DR TI 14-SOIC New 详细
TPS61000DGSR TI 10-VSSOP New 详细
SCAN926260TUF TI 196-NFBGA (15x15) New 详细
LP2995M/NOPB TI 8-SOIC New 详细
ADC0848BCVX TI 28-PLCC (11.51x11.51) New 详细
TLV7111833DDSET TI 6-WSON (1.5x1.5) New 详细
SN74AHCT174DR TI New 详细
SN74LVC126AD TI 14-SOIC New 详细
SN74AUP1T57YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细