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  • LM3S610-IGZ50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : Stellaris? ARM? Cortex?-M3S 600
    Part Status : Discontinued at Digi-Key
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 34
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Data Converters : A/D 2x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
OMAP3530DCBBA TI 515-POP-FCBGA (12x12) New 详细
DS90CR286ATDGGRQ1 TI 16-HTSSOP New 详细
SM72295E/NOPB TI 28-SOIC New 详细
TPS2060CDGNR TI 8-MSOP-PowerPad New 详细
MSP430F6635IZQWT TI 113-BGA Microstar Junior (7x7) New 详细
UC2875DWP TI 28-SOIC New 详细
DRV5013ADQLPGMQ1 TI TO-92-3 New 详细
TSC2004EVM TI New 详细
LP2981AIBP-3.3 TI 5-μSMD (0.93x1.11) New 详细
LM2902N/PB TI 14-DIP New 详细
DCP020509P TI 7-PDIP New 详细
TPS2343DDPG3 TI 80-HTSSOP New 详细
LM536253QRNLTQ1 TI 22-VQFN-HR (5x4) New 详细
LP38841SX-0.8 TI DDPAK/TO-263-5 New 详细
SN74LV32ATPWRG4Q1 TI 14-TSSOP New 详细
LMS1587ISX-3.3 TI DDPAK/TO-263-3 New 详细
SG3524D TI 16-SOIC New 详细
TMS320DM8168CCYGH TI 1031-FCBGA (25x25) New 详细
LMC6462BIN/NOPB TI 8-PDIP New 详细
UC2572D TI 8-SOIC New 详细