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  • LM3S600-EQN50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 600
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
SN74CBT3383CDBRE4 TI 24-SSOP New 详细
TPS75801KTTR TI DDPAK/TO-263-5 New 详细
UA7812CKTTRG3 TI DDPAK/TO-263-3 New 详细
SN74LVC1G66DCKT TI SC-70-5 New 详细
TPS3619-33DGK TI 8-VSSOP New 详细
PTRF1222IRTMR TI 32-VQFN (5x5) New 详细
TPS3823-33QDBVRQ1 TI SOT-23-5 New 详细
UA78M05IDCYG3 TI SOT-223-4 New 详细
LM2576T-ADJ/NOPB TI TO-220-5 New 详细
TLC25L4CD TI 14-SOIC New 详细
ADS5296ARGCT TI 64-VQFN (9x9) New 详细
TPS22970YZPR TI 8-DSBGA New 详细
PT5028LT TI New 详细
SN74HC166DR TI 16-SOIC New 详细
CD4029BNSR TI 16-SO New 详细
SN74AUP1G06DCKR TI SC-70-5 New 详细
SN74ALS33AD TI 14-SOIC New 详细
TPS389015QDSERQ1 TI 6-WSON (1.5x1.5) New 详细
TMS320C31PQL60 TI 132-BQFP (24.54x24.54) New 详细
TLV2775CD TI 16-SOIC New 详细