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  • LM3S600-EGZ50-C2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : Stellaris? ARM? Cortex?-M3S 600
    Part Status : Discontinued at Digi-Key
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 32KB (32K x 8)
    Program Memory Type : FLASH
    RAM Size : 8K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 105°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

极速报价

型号
品牌 封装 批号 查看
UCC39422PW TI 20-TSSOP New 详细
LP3875ESX-3.3/NOPB TI DDPAK/TO-263-5 New 详细
UCC384DP-12 TI 8-SOIC New 详细
SN65C3222DWG4 TI 20-SOIC New 详细
LM4041DIDCKR TI SC-70-5 New 详细
SN74HC191NSR TI 16-SO New 详细
LP5904TME-3.1/NOPB TI 4-DSBGA (0.81x0.81) New 详细
UC3836D TI 8-SOIC New 详细
LMV934IPWRE4 TI 14-TSSOP New 详细
INA139QPWRG4Q1 TI 8-TSSOP New 详细
LM2795BLX/NOPB TI 14-DSBGA New 详细
TPS767D318PWP TI 28-HTSSOP New 详细
TLC073IDR TI 14-SOIC New 详细
LP3972SQ-I514EV/NOPB TI New 详细
ADS62P29IRGC25 TI 64-VQFN (9x9) New 详细
OPA551FAKTWT TI DDPAK/TO-263-7 New 详细
LM1117SX-3.3/NOPB TI DDPAK/TO-263-3 New 详细
DS90CR282MTD TI 56-TSSOP New 详细
SN74LVC125AQDRG4Q1 TI 14-SOIC New 详细
UC382TDKTTT-ADJ TI DDPAK/TO-263-5 New 详细