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  • LM3S300-IQN25-C2T

  • Manufacturer : Texas Instruments
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 300
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 25MHz
    Connectivity : I2C, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 36
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 4K x 8
    Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-LQFP
    Supplier Device Package : 48-LQFP (7x7)

极速报价

型号
品牌 封装 批号 查看
LP3963ESX-3.3 TI DDPAK/TO-263-5 New 详细
LM2724AMX/NOPB TI 8-SOIC New 详细
SN74AUC1G19DBVT TI SOT-23-6 New 详细
UCC28514N TI 20-PDIP New 详细
LM101AH/NOPB TI TO-5-8 New 详细
CD40147BM96E4 TI 16-SOIC New 详细
SN74ALVCHR16409GR TI 56-TSSOP New 详细
OPA37GU TI 8-SOIC New 详细
LMK60I2-100M00SIAT TI 6-QFM (7x5) New 详细
PCI2050IGHK TI 209-PBGA (16x16) New 详细
TLV2444IPWR TI 14-TSSOP New 详细
78SR174SC TI New 详细
TMS320C6745BPTP3 TI 176-HLQFP (24x24) New 详细
SN74AHCT1G125DCKT TI SC-70-5 New 详细
LP3990MF-3.3/NOPB TI SOT-23-5 New 详细
DRV8432EVM TI New 详细
BQ24001RGWR TI 20-VQFN (5x5) New 详细
TPS72625KTTT TI DDPAK/TO-263-5 New 详细
LF412CN TI 8-PDIP New 详细
SN74BCT2241DWRG4 TI 20-SOIC New 详细