产品系列

罗斌森
  • LM3S1Z16-IQR50-C3

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : Stellaris? ARM? Cortex?-M3S 1000
    Part Status : Obsolete
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, DMA, POR, PWM, WDT
    Number of I/O : 33
    Program Memory Size : 16KB (16K x 8)
    Program Memory Type : FLASH
    RAM Size : 6K x 8
    Voltage - Supply (Vcc/Vdd) : 1.08V ~ 1.32V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 64-LQFP
    Supplier Device Package : 64-LQFP (10x10)

极速报价

型号
品牌 封装 批号 查看
LM2776DBVR TI SOT-23-6 New 详细
TPS7A3001DGNR TI 8-MSOP-PowerPad New 详细
TPS51217DSCT TI 10-WSON (3x3) New 详细
OPA2237UA/2K5 TI 8-SOIC New 详细
TPS5431EVM-173 TI New 详细
TLV70022DDCT TI SOT-23-5 New 详细
DRV5023BIQDBZRQ1 TI SOT-23-3 New 详细
TPS544B25EVM-681 TI New 详细
PT5024S TI New 详细
PCM2705DBG4 TI 28-SSOP New 详细
LM340AT-5.0/NOPB TI TO-220-3 New 详细
UCC27201ADPRR TI 10-WSON (4x4) New 详细
LM2901NG4 TI 14-PDIP New 详细
BQ24273YFFR TI 49-DSBGA (2.8x2.8) New 详细
CY74FCT244TSOC TI 20-SOIC New 详细
SN65HVD232QD TI 8-SOIC New 详细
LMC6082AIN TI 8-PDIP New 详细
CD74HC157E TI 16-PDIP New 详细
MSP430F157IRTDT TI 64-VQFN (9x9) New 详细
SN74LVC1G18YEPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细