产品系列

罗斌森
  • LM3S2911-IBZ50-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 2000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 60
    Program Memory Size : 256KB (256K x 8)
    Program Memory Type : FLASH
    RAM Size : 64K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
ADS5121IZHK TI 257-BGA MICROSTAR (16x16) New 详细
MSP430F156IPMR TI 64-LQFP (10x10) New 详细
LM2731XMF TI SOT-23-5 New 详细
LMH6628MAX TI 8-SOIC New 详细
BQ24160ARGET TI 24-VQFN (4x4) New 详细
TPS65218B1RSLR TI 48-VQFN (6x6) New 详细
SN65HVD235D TI 8-SOIC New 详细
DF1704E/2K TI 28-SSOP New 详细
LP3990TL-2.5/NOPB TI 4-DSBGA (1x1) New 详细
SN74CBTK6800DW TI 24-SOIC New 详细
TAS5709APHPR TI 48-HTQFP (7x7) New 详细
SM72480SD-105/NOPB TI 6-WSON (2.2x2.5) New 详细
THS6301IRSAT TI 16-VQFN-EP (4x4) New 详细
TPS53316RGTR TI 16-QFN (3x3) New 详细
TLE2022QDREP TI 8-SOIC New 详细
LM6152ACM TI 8-SOIC New 详细
LM2679S-3.3/NOPB TI DDPAK/TO-263-7 New 详细
LMV551MF/NOPB TI SOT-23-5 New 详细
TPS54260DGQR TI 10-MSOP-PowerPad New 详细
OMAPL137CZKBT3 TI 256-BGA (17x17) New 详细