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  • LM3S2608-IBZ50-A2

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Alternate Packaging
    Series : Stellaris? ARM? Cortex?-M3S 2000
    Part Status : Not For New Designs
    Core Processor : ARM? Cortex?-M3
    Core Size : 32-Bit
    Speed : 50MHz
    Connectivity : CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART
    Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
    Number of I/O : 52
    Program Memory Size : 128KB (128K x 8)
    Program Memory Type : FLASH
    RAM Size : 32K x 8
    Voltage - Supply (Vcc/Vdd) : 2.25V ~ 2.75V
    Data Converters : A/D 8x10b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 108-LFBGA
    Supplier Device Package : 108-BGA (10x10)

极速报价

型号
品牌 封装 批号 查看
TL7726CDR TI 8-SOIC New 详细
TPS76925DBVR TI SOT-23-5 New 详细
ADS8681IRUMR TI 16-WQFN (4x4) New 详细
TPS82676SIPR TI 8-uSIP New 详细
AMC1106E05DWV TI 8-SOIC New 详细
PT78ST107H TI New 详细
MSP430F2418TPMR TI 64-LQFP (10x10) New 详细
LM4120IM5-3.3/NOPB TI SOT-23-5 New 详细
LM81CIMTX-3 TI 24-TSSOP New 详细
DS90C365AMT TI 48-TSSOP New 详细
LM2575N-5.0/NOPB TI 16-DIP New 详细
SN74LV4051APWR TI 16-TSSOP New 详细
REG103FA-5/500 TI DDPAK/TO-263-5 New 详细
TPS62125DSGT TI 8-WSON (2x2) New 详细
SN74ABT8652DWRG4 TI 28-SOIC New 详细
CD74HC4060M TI 16-SOIC New 详细
ADS1282SJDJ TI 28-CDIP New 详细
TLC251CD TI 8-SOIC New 详细
LM3705XBMM-463/NOPB TI 10-VSSOP New 详细
TMS320DM648CUTD9 TI 529-FCBGA (19x19) New 详细