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罗斌森
  • ISO7742FDBQ

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 4
    Inputs - Side 1/Side 2 : 2/2
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 3.9ns, 3.9ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SSOP (0.154", 3.90mm Width)
    Supplier Device Package : 16-SSOP

极速报价

型号
品牌 封装 批号 查看
TPS61254YFFR TI 9-DSBGA (1.2x1.3) New 详细
MCP810M3-4.38/NOPB TI SOT-23-3 New 详细
MSP430FR5949IDA TI 38-TSSOP New 详细
BQ78PL114RGZT TI 48-VQFN (7x7) New 详细
TLV3701QDBVREP TI SOT-23-5 New 详细
SN74AUP1T97YZPR TI 6-DSBGA, 6-WCSP (1.4x0.9) New 详细
TLV70329DBVR TI SOT-23-5 New 详细
CLVTH32374IGKEREP TI New 详细
BQ2013HSN-A514TRG4 TI 16-SOIC New 详细
BQ27501DRZR TI 12-SON (2.5x4) New 详细
CD74ACT153M TI 16-SOIC New 详细
SN74CB3Q16210DGGR TI 48-TSSOP New 详细
LM4140CCM-2.0 TI 8-SOIC New 详细
MSP430F2254TDAR TI 38-TSSOP New 详细
LM2576HVT-5.0 TI TO-220-5 New 详细
CDCI6214RGET TI 24-VQFN (4x4) New 详细
TL494CDBR TI 16-SSOP New 详细
TSC2301IGQZR TI 120-BGA Microstar Junior (6x6) New 详细
MSP-ISO TI New 详细
TMS320C6748BZWT4 TI 361-NFBGA (16x16) New 详细