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罗斌森
  • ISO7421ED

  • Manufacturer : Texas Instruments
    Packaging : Bulk
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 2
    Inputs - Side 1/Side 2 : 1/1
    Channel Type : Unidirectional
    Voltage - Isolation : 2500Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 50Mbps
    Propagation Delay tpLH / tpHL (Max) : 11ns, 11ns
    Pulse Width Distortion (Max) : 3.7ns
    Rise / Fall Time (Typ) : 1.8ns, 1.7ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
CY74FCT2245ATPWR TI 20-TSSOP New 详细
SN74ABT373PWR TI 20-TSSOP New 详细
SN74AUP1G08QDCKRQ1 TI SC-70-5 New 详细
CS4210VJG TI 100-QFP (14x14) New 详细
SN74HC540DW TI 20-SOIC New 详细
PCM2705DBR TI 28-SSOP New 详细
LM26CIM5X-YPA TI SOT-23-5 New 详细
LM109H TI TO-39-3 New 详细
CY74FCT374CTQCT TI New 详细
LM2661MMX/NOPB TI 8-VSSOP New 详细
LP2981IBPX-3.2 TI 5-μSMD (0.93x1.11) New 详细
LT1004CPWG4-2-5 TI 8-TSSOP New 详细
SN74S260N TI 14-PDIP New 详细
LM4050BIM3X-2.5 TI SOT-23-3 New 详细
PGA302EPWT TI 16-TSSOP New 详细
TLV2375IDR TI 16-SOIC New 详细
LP3852EMP-3.3/NOPB TI SOT-223-5 New 详细
LMR33620CQRNXTQ1 TI 12-VQFN-HR (3x2) New 详细
LP3963ESX-1.8 TI DDPAK/TO-263-5 New 详细
TPA3001D1PWPR TI 24-HTSSOP New 详细