产品系列

罗斌森
  • ISO7341CQDWRQ1

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : Automotive, AEC-Q100
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 4
    Inputs - Side 1/Side 2 : 3/1
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 25Mbps
    Propagation Delay tpLH / tpHL (Max) : 58ns, 58ns
    Pulse Width Distortion (Max) : 4ns
    Rise / Fall Time (Typ) : 2.1ns, 1.7ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
UCC3808ADTR-2 TI 8-SOIC New 详细
TWL6030B107CMRR TI 187-FCBGA (7x7) New 详细
OPT3002DNPT TI 6-USON (2x2) New 详细
UCC5630AMWPG4 TI 36-SSOP New 详细
CD74HCT173E TI New 详细
TPS40132RHBR TI 32-VQFN (5x5) New 详细
MSP430F2617TPM TI 64-LQFP (10x10) New 详细
OPA2373AIDRCR TI 10-VSON (3x3) New 详细
TCA6408RGTR TI 16-QFN (3x3) New 详细
SN74HCT652NT TI 24-PDIP New 详细
LM2724LD TI 8-WSON (4x4) New 详细
SN74ALS575ADWRG4 TI New 详细
LM2936MM-3.3 TI 8-VSSOP New 详细
DAC6311IDCKR TI SC-70-6 New 详细
CD74HC221PWT TI 16-TSSOP New 详细
LM3S1J11-IQC50-C3 TI 100-LQFP (14x14) New 详细
SN74CBT16232DGGR TI 56-TSSOP New 详细
ADS5541IPAP TI 64-HTQFP (10x10) New 详细
SN74LVC1G27DBVR TI SOT-23-6 New 详细
SN74LV245AGQNR TI 20-BGA MICROSTAR JUNIOR (4x3) New 详细