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ISO7331FCDW
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Type : General Purpose
Isolated Power : No
Number of Channels : 3
Inputs - Side 1/Side 2 : 2/1
Channel Type : Unidirectional
Voltage - Isolation : 3000Vrms
Common Mode Transient Immunity (Min) : 25kV/μs
Data Rate : 25Mbps
Propagation Delay tpLH / tpHL (Max) : 58ns, 58ns
Pulse Width Distortion (Max) : 4ns
Rise / Fall Time (Typ) : 3ns, 2ns
Voltage - Supply : 3V ~ 5.5V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 16-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
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| LM3S1N16-IQR50-C3T | TI | 64-LQFP (10x10) | New | 详细 | |
| RM48L930ZWTT | TI | 337-NFBGA (16x16) | New | 详细 | |
| DAC80508ZCRTER | TI | 16-WQFN (3x3) | New | 详细 | |
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| SN761664DBTG4 | TI | 38-TSSOP | New | 详细 | |
| SN74AUC1GU04YZPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| ADS850Y/250 | TI | 48-TQFP (7x7) | New | 详细 | |
| AFE030AIRGZR | TI | 48-VQFN (7x7) | New | 详细 | |
| SN74AHC1G126DRLR | TI | SOT-5 | New | 详细 | |
| DEM-OPA-SSOP-3D | TI | New | 详细 |
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