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ISO7331FCDW
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Technology : Capacitive Coupling
Type : General Purpose
Isolated Power : No
Number of Channels : 3
Inputs - Side 1/Side 2 : 2/1
Channel Type : Unidirectional
Voltage - Isolation : 3000Vrms
Common Mode Transient Immunity (Min) : 25kV/μs
Data Rate : 25Mbps
Propagation Delay tpLH / tpHL (Max) : 58ns, 58ns
Pulse Width Distortion (Max) : 4ns
Rise / Fall Time (Typ) : 3ns, 2ns
Voltage - Supply : 3V ~ 5.5V
Operating Temperature : -40°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package : 16-SOIC
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| ADC121S705EB/NOPB | TI | New | 详细 | ||
| CD74HCT4046AM96E4 | TI | New | 详细 | ||
| LMH0002SQ/S250 | TI | 16-WQFN (4x4) | New | 详细 | |
| SN65HVD379D | TI | 8-SOIC | New | 详细 | |
| REF6233IDGKT | TI | 8-VSSOP | New | 详细 | |
| LM3503SQX-16 | TI | 16-WQFN (4x4) | New | 详细 | |
| LMH6639MF | TI | SOT-23-6 | New | 详细 | |
| LM34919BQTL/NOPB | TI | 10-Microbump | New | 详细 | |
| OMAPL137BZKBA3 | TI | 256-BGA (17x17) | New | 详细 | |
| TMS32C6713BGDPA200 | TI | 272-BGA (27x27) | New | 详细 | |
| LM3S6C11-IBZ80-A1T | TI | 108-BGA (10x10) | New | 详细 | |
| PGA308AIDRKT | TI | 10-VSON (3x4) | New | 详细 | |
| TPIC6B595DWG4 | TI | 20-SOIC | New | 详细 | |
| TPS77525MPWPREP | TI | 20-HTSSOP | New | 详细 | |
| S5LS10206ASPGEQQ1 | TI | 144-LQFP (20x20) | New | 详细 | |
| TPS65310AQRVJRQ1 | TI | 56-VQFN (8x8) | New | 详细 | |
| SN74LVTH16245ADGGR | TI | 48-TSSOP | New | 详细 | |
| TPS75615KTTRG3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM74CITP-5/NOPB | TI | 5-DSBGA | New | 详细 | |
| TPS62130ARGTT | TI | 16-QFN (3x3) | New | 详细 |
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