产品系列

罗斌森
  • HPC36003V30

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Series : HPC?
    Part Status : Obsolete
    Core Processor : HPC
    Core Size : 16-Bit
    Speed : 30MHz
    Connectivity : Microwire/Plus (SPI), UART/USART
    Peripherals : PWM, WDT
    Number of I/O : 52
    Program Memory Type : ROMless
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 4.5V ~ 5.5V
    Oscillator Type : External
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 68-LCC (J-Lead)
    Supplier Device Package : 68-PLCC (25.13x25.13)

极速报价

型号
品牌 封装 批号 查看
UCC2803D TI 8-SOIC New 详细
MSP430F47127IPZ TI 100-LQFP (14x14) New 详细
MSP430F2274MRHATEP TI 40-VQFN (6x6) New 详细
MSP430FG4260IRGZT TI 48-VQFN (7x7) New 详细
PTH05060WAH TI New 详细
TLC25L2CPSRG4 TI 8-SO New 详细
COP8SAC744J3 TI 44-PLCC (16.58x16.58) New 详细
SN74LS163ADR TI 16-SOIC New 详细
SN74ABT7819A-12PH TI 80-QFP (14x20) New 详细
PTMA403033A1AD TI New 详细
LM3S2533-IQC50-A2 TI 100-LQFP (14x14) New 详细
SN74AUP1G32DBVT TI SOT-23-5 New 详细
AM3354BZCZA100 TI 324-NFBGA(15x15) New 详细
TLV2635IDR TI 16-SOIC New 详细
TLV376IDR TI 8-SOIC New 详细
TL431CDBVRE4 TI SOT-23-5 New 详细
SN74LVC1G27DCKRG4 TI New 详细
SN74HC21D TI 14-SOIC New 详细
CDCR83DBQRG4 TI 24-SSOP/QSOP New 详细
SN74LV574APWR TI New 详细