产品系列

罗斌森
  • ISO7330CDW

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 3
    Inputs - Side 1/Side 2 : 3/0
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 25Mbps
    Propagation Delay tpLH / tpHL (Max) : 58ns, 58ns
    Pulse Width Distortion (Max) : 4ns
    Rise / Fall Time (Typ) : 3ns, 2ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
TPA0232PWP TI 24-HTSSOP New 详细
TPS70845PWP TI 20-HTSSOP New 详细
SN74HC191D TI 16-SOIC New 详细
74FCT2543CTSOCTG4 TI 24-SOIC New 详细
SN74AHCT08DGVR TI 14-TVSOP New 详细
SN74ABT16601DGGR TI 56-TSSOP New 详细
LM3S5G31-IQC80-A2 TI 100-LQFP (14x14) New 详细
MSP430F1610IRTDT TI 64-VQFN (9x9) New 详细
TPS65910A1RSLR TI 48-VQFN (6x6) New 详细
TPS54326RGTR TI 16-QFN (3x3) New 详细
ADS1198CZXGT TI 64-NFBGA (8x8) New 详细
CSD97374Q4M TI 8-VSON (3.5x4.5) New 详细
TPS3126E18DBVT TI SOT-23-5 New 详细
SN74ALVCH16646DGGR TI 56-TSSOP New 详细
MSP430FR5992IZVWR TI 87-NFBGA (6x6) New 详细
SN74LV374ATDWG4 TI New 详细
SN74AUC2G53DCTR TI SM8 (SSOP) New 详细
DAC7625P TI 28-PDIP New 详细
74AVCB164245ZRDR TI 54-BGA MICROSTAR JUNIOR (8.0x5.5) New 详细
CCB3Q3306AMPWREP TI New 详细