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  • ISO7310FCDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 1
    Inputs - Side 1/Side 2 : 1/0
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 25Mbps
    Propagation Delay tpLH / tpHL (Max) : 58ns, 58ns
    Pulse Width Distortion (Max) : 4ns
    Rise / Fall Time (Typ) : 2.5ns, 2ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
SN65LVDS2D TI 8-SOIC New 详细
LMH6560MAX/NOPB TI 14-SOIC New 详细
UCC281DPTR-5G4 TI 8-SOIC New 详细
CD4063BPWE4 TI New 详细
LMV824Q1MTX/NOPB TI 14-TSSOP New 详细
SN74ALS679NSRE4 TI New 详细
CD4077BE TI 14-PDIP New 详细
TL4050C50IDBZR TI SOT-23-3 New 详细
TPS3125J12DBVR TI SOT-23-5 New 详细
LM3822MMX-1.0 TI 8-VSSOP New 详细
PCM2900CEVM-U TI New 详细
SN65HVD231QDR TI 8-SOIC New 详细
TPS61220EVM-319 TI New 详细
TLV2452CDGKR TI 8-VSSOP New 详细
LP3985IBP-4.7 TI 5-DSBGA (1.41x1.08) New 详细
REF02AU/2K5 TI 8-SOIC New 详细
TLC7524CN TI 16-PDIP New 详细
LM4674TLX/NOPB TI 16-DSBGA (2.5x2.12) New 详细
BQ24630RGER TI 24-VQFN (4x4) New 详细
TMS320DM6435ZDUQ4 TI 376-BGA (23x23) New 详细