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  • ISO7231CDWR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 3
    Inputs - Side 1/Side 2 : 2/1
    Channel Type : Unidirectional
    Voltage - Isolation : 2500Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 25Mbps
    Propagation Delay tpLH / tpHL (Max) : 42ns, 42ns
    Pulse Width Distortion (Max) : 2.5ns
    Rise / Fall Time (Typ) : 2ns, 2ns
    Voltage - Supply : 3.15V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
TLC3704QDRQ1 TI 14-SOIC New 详细
ADS8861IDRCT TI 10-VSON (3x3) New 详细
TRS3232ECDBG4 TI 16-SSOP New 详细
SN74LVC1G08DSF2 TI 6-SON (1x1) New 详细
SM72442X/NOPB TI 28-TSSOP New 详细
LM3S9971-IBZ80-C3T TI 108-BGA (10x10) New 详细
LMP2021MF/NOPB TI SOT-23-5 New 详细
TLC0834IN TI 14-PDIP New 详细
TPA4411MRTJR TI 20-QFN (4x4) New 详细
SN74AUP1G98DRYR TI 6-SON (1.45x1) New 详细
INA114BU TI 16-SOIC New 详细
UCC3813D-0 TI 8-SOIC New 详细
OPA355UA TI 8-SOIC New 详细
ADS1610IPAPT TI 64-HTQFP (10x10) New 详细
CSD87351ZQ5D TI 8-LSON (5x6) New 详细
LMK61A2-125M00EVM TI New 详细
LM3S6432-IQC50 TI 100-LQFP (14x14) New 详细
OPA344PA TI 8-PDIP New 详细
LM3704XDMMX-463 TI 10-VSSOP New 详细
BQ4847MT TI 28-DIP Module (18.42x38.8) New 详细