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  • ISO721MDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 1
    Inputs - Side 1/Side 2 : 1/0
    Channel Type : Unidirectional
    Voltage - Isolation : 2500Vrms
    Common Mode Transient Immunity (Min) : 25kV/μs
    Data Rate : 150Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 1ns
    Rise / Fall Time (Typ) : 1ns, 1ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
MSP430F248TRGCT TI 64-VQFN (9x9) New 详细
TPS77533DR TI 8-SOIC New 详细
TAS5162DDV6EVM2 TI New 详细
TPA0132PWPR TI 24-HTSSOP New 详细
TPS82675EVM-646 TI New 详细
LM34923MMX/NOPB TI 10-VSSOP New 详细
LM3915N-1/NOPB TI 18-DIP New 详细
LMZ30604EVM-001 TI New 详细
TPS77518QPWPRQ1 TI 20-HTSSOP New 详细
LM6144BIM TI 14-SOIC New 详细
SN74LS243N TI 14-PDIP New 详细
SN74LV14AMDREP TI 14-SOIC New 详细
LMV722M TI 8-SOIC New 详细
LM4040B82IDCKR TI SC-70-5 New 详细
SN74LV4052AQPWRQ1 TI 16-TSSOP New 详细
SN74AC14QPWRQ1 TI 14-TSSOP New 详细
MSP430FR5959IRHAR TI 40-VQFN (6x6) New 详细
THS6053IPWPRG4 TI 14-HTSSOP New 详细
LM4040C50IDBZRG4 TI New 详细
THS6062IDGNR TI 8-MSOP-PowerPad New 详细