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  • DS25BR100TSD/NOPB

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, ReDriver
    Applications : LVDS
    Input : CML, LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 3.125Gbps
    Number of Channels : 1
    Delay Time : 350ps
    Signal Conditioning : Input Equalization, Output Pre-Emphasis
    Capacitance - Input : 1.7pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 35mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-WFDFN Exposed Pad
    Supplier Device Package : 8-WSON (3x3)

极速报价

型号
品牌 封装 批号 查看
TPS3851EVM-780 TI New 详细
TPD12S015YFFR TI 28-DSBGA (2.79x1.59) New 详细
LM2734X EVAL TI New 详细
UCD7230PWPR TI 20-HTSSOP New 详细
TLV2262AQPWRQ1 TI 8-TSSOP New 详细
TS5A23157TDGSRQ1 TI 10-VSSOP New 详细
ISO7721FDW TI 16-SOIC New 详细
LM2592HVS-3.3/NOPB TI DDPAK/TO-263-5 New 详细
TPS54340EVM-182 TI New 详细
TPS75525KC TI TO-220-5 New 详细
CD74HCT221E TI 16-PDIP New 详细
74AC11032N TI 16-PDIP New 详细
UC2856DW TI 16-SOIC New 详细
TPPM0301DR TI 8-SOIC New 详细
TPS5402DR TI 8-SOIC New 详细
LP2987AIMX-3.0 TI 8-SOIC New 详细
PCA9548ARGER TI 24-VQFN (4x4) New 详细
TPS75733KTTR TI DDPAK/TO-263-5 New 详细
TPD2S703QDSKRQ1 TI 10-WSON (2.5x2.5) New 详细
SN74LVC2244APWR TI 20-TSSOP New 详细