产品系列
DS25BR100TSD/NOPB
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Type : Buffer, ReDriver
Applications : LVDS
Input : CML, LVDS, LVPECL
Output : LVDS
Data Rate (Max) : 3.125Gbps
Number of Channels : 1
Delay Time : 350ps
Signal Conditioning : Input Equalization, Output Pre-Emphasis
Capacitance - Input : 1.7pF
Voltage - Supply : 3V ~ 3.6V
Current - Supply : 35mA
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 8-WFDFN Exposed Pad
Supplier Device Package : 8-WSON (3x3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| SN74BCT623DWRE4 | TI | 20-SOIC | New | 详细 | |
| OPA228UA | TI | 8-SOIC | New | 详细 | |
| ADC082S051CIMMX/NOPB | TI | 8-VSSOP | New | 详细 | |
| DS90LV019TMX | TI | 14-SOIC | New | 详细 | |
| LP3856ES-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| LP3874ES-1.8/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| OMAPL137BZKB4 | TI | 256-BGA (17x17) | New | 详细 | |
| TLV2782AIDR | TI | 8-SOIC | New | 详细 | |
| LM34910CSDX/NOPB | TI | 10-WSON (4x4) | New | 详细 | |
| PGA205BU | TI | 16-SOIC | New | 详细 | |
| LM2592HVS-5.0 | TI | DDPAK/TO-263-5 | New | 详细 | |
| HD3SS3212RKSR | TI | 20-VQFN (4.5x2.5) | New | 详细 | |
| LP3982ILD-3.3 | TI | 8-WSON (3x2.5) | New | 详细 | |
| DRV8307RHAR | TI | 40-VQFN (6x6) | New | 详细 | |
| SN65HVD12DR | TI | 8-SOIC | New | 详细 | |
| CD74AC20M | TI | 14-SOIC | New | 详细 | |
| SN74F138DR | TI | 16-SOIC | New | 详细 | |
| SN65HVD10P | TI | 8-PDIP | New | 详细 | |
| LP3856ESX-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| TPS92692PWPR | TI | 20-HTSSOP | New | 详细 |
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