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罗斌森

DRV5023BIEDBZRQ1
Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active

SE555P	TI	8-PDIP	New	详细
型号	品牌	封装	批号	查看
LM2575S-15	TI	DDPAK/TO-263-5	New	详细
ADC122S706EB/NOPB	TI		New	详细
BQ4011YMA-70N	TI	28-DIP Module (18.42x37.72)	New	详细
LM4845ITL/NOPB	TI	25-DSBGA	New	详细
SN74BCT25244NSRG4	TI	24-SO	New	详细
SN74LVC3G06YZPR	TI	8-DSBGA, 8-WCSP (1.9x0.9)	New	详细
ADS5474ADX-EVM	TI		New	详细
TPS54010EVM-067	TI		New	详细
TPS79628DCQR	TI	SOT-223-6	New	详细
LM218IDRQ1	TI	8-SOIC	New	详细
TRF3761-BIRHAT	TI	40-VQFN (6x6)	New	详细
CDCLVD110VFRG4	TI	32-LQFP (7x7)	New	详细
DRV8402DKD	TI	36-HSSOP	New	详细
THS3062DRG4	TI	8-SOIC	New	详细
LMH0384SQ/NOPB	TI	16-WQFN (4x4)	New	详细
SN74HCT139DT	TI	16-SOIC	New	详细
ISO7321CDR	TI	8-SOIC	New	详细
SN74S151N	TI	16-PDIP	New	详细
ADS8345EB	TI	20-SSOP/QSOP	New	详细